英伟达推出更强大的AI芯片后，将提振哪些股？

金融界03-29

在英伟达Nvidia推出功能强大的新人工智能芯片之后，高盛预测，用于人工智能系统的存储芯片将大幅增长。英伟达为人工智能模型提供动力的新型GPU芯片Blackwell需要最新的第三代内存芯片，也就是高带宽内存(HBM/HBM3E)。这家投资银行预计，到2026年，HBM的潜在总市场规模将扩大10倍，达到230亿美元，而2022年仅为23亿美元。这家华尔街银行认为，三家主要内存制造商将是HBM市场...

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Lee为首的高盛分析师在3月22日给客户的一份报告中表示，这三家公司“都将受益于HBM市场的强劲增长和(供需)紧张，因为这将导致HBM价格持续大幅溢价，并可能增加每家公司的整体DRAM利润率。”投资者一直对用于人工智能系统的内存市场持谨慎态度，因为三大供应商都将扩大产能，增加利润率的下行压力。不过，高盛分析师认为，与传统DRAM内存芯片相比，HBM的芯片尺寸更大、产量更低等挑战，可能在近期令供应紧张。持这种观点的不只是这家华尔街银行。今年2月，花旗分析师也曾向客户提供过类似的建议。花旗分析师Peter Lee在2月27日给客户的报告中称，\"尽管市场担心随着三家DRAM制造商进入HBM3E领域，HBM可能供过于求，但鉴于英伟达和其他人工智能客户的需求增长，以及低产量和内存制造复杂性增加导致的供应增长有限，我们预计HBM3E领域将持续供应紧张。\"高盛还援引供应商的话:“他们2024年的HBM产能已全部预订，而2025年的供应已分配给客户。”不过，这家投银预计，SK Hynix凭借“强大的客户/供应链关系”，以及被认为“比同行的解决方案具有更高的生产率和收益率”的技术，至少在未来几年内将保持50%以上的市场份额。高盛分析师还表示，Samsung Electronics“有机会在中期内扩大市场份额”。本月早些时候，英伟达首席执行官黄仁勋在一次媒体发布会上暗示，英伟达正在为其图形处理器认证Samsung Electronics最新的HBM3E芯片。与此同时，这家投行表示，通过缩小对HBM3E标准的关注，Micron可能会在2025年开始超越竞争对手。\n\n\r\n            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