报告：去年Q4台积电(TSM)晶圆代工独占61%份额

金吾资讯03-28

金吾财讯 | 据媒体，研究机构Counterpoint报告显示，2023年第四季度台积电(TSM)独占全球晶圆代工市场61%份额，位居主导地位；三星(SSNLF)受益于智能手机补货和三星Galaxy S24系列的上市预购，保持第二名，市场份额14%。联电(UMC)、格芯(GFS)市场份额约6%，需求低迷和库存调整（尤其是在汽车和工业领域）影响了这两家公司，进而对2024年的目标预期保守；中芯国际...

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