SK海力士量产下一代HBM芯片首批交付予Nvidia(NVDA.US)

阿斯达克财经03-19

SK海力士宣布，已开始量产用于AI芯片组合的下一代高带宽内存(HBM)芯片HBM3E，据悉，首批出货将交付予Nvidia(NVDA.US) 。HBM3E芯片目前是市场上的焦点新型芯片，上月美光科技 (MU.US) 表示已开始大量生产该HBM3E芯片，而三星则称已开发出业界首款12层HBM3E芯片。(mn/da)(美股为即时串流报价； OTC市场股票除外，资料延迟最少15分钟。)AASTOCKS...

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SK海力士量产下一代HBM芯片 首批交付予Nvidia(NVDA.US)

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SK海力士量产下一代HBM芯片首批交付予Nvidia(NVDA.US)