传群创成功拿下恩智浦面板级扇出型封装大单！

芯智讯01-29

1月29日消息，据台媒报道，面板大厂群创的半导体业务已成功拿下了欧洲半导体大厂恩智浦（NXP）面板级扇出型封装（FOPLP）大单。恩智浦几乎包下群创相关所有产能，将在下半年量产出货。据了解，群创布局面板级扇出型封装技术已有八年，这次夺下恩智浦大单，将让群创初期构建的Chip-First制程产能满载，今年准备启动第二期扩产计划，为2025年扩充产能投入量产做好准备。报道称，群创是以现有3.5代面板...

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href=http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202401291252088757de98&s=b><strong>芯智讯</strong></a>\n\n\n</h4>\n\n</header>\n<article>\n<div>\n<p>1月29日消息，据台媒报道，面板大厂群创的半导体业务已成功拿下了欧洲半导体大厂恩智浦（NXP）面板级扇出型封装（FOPLP）大单。恩智浦几乎包下群创相关所有产能，将在下半年量产出货。据了解，群创布局面板级扇出型封装技术已有八年，这次夺下恩智浦大单，将让群创初期构建的Chip-First制程产能满载，今年准备启动第二期扩产计划，为2025年扩充产能投入量产做好准备。报道称，群创是以现有3.5代面板...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202401291252088757de98&s=b\">网页链接</a>\n\n</div>\n\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0175139822.USD","symbol_name":"AB FCP I Global Equity Blend A 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