卢伟冰今年最后一个大招！Redmi K70曝光：最强旗舰焊门员

快科技官方2023-09-26

快科技9月25日消息，博主数码闲聊站透露，Redmi K70系列将于11月底或12月初登场，有望在双12之前上市发售。据爆料，和上一代一样，Redmi K70系列分为标准版和Pro版两款，全系标配2K OLED柔性直屏，标准版搭载高通骁龙8 Gen2芯片，Pro版搭载高通骁龙8 Gen3芯片。其中骁龙8 Gen3是高通新一代移动平台，这颗芯片将于10月底登场，预计会由小米14系列全球首发。 ...

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Redmi K70 Exposure: The Strongest Flagship Welder","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"QCOM":0.9},"content_text":"快科技9月25日消息，博主数码闲聊站透露，Redmi K70系列将于11月底或12月初登场，有望在双12之前上市发售。据爆料，和上一代一样，Redmi K70系列分为标准版和Pro版两款，全系标配2K OLED柔性直屏，标准版搭载高通骁龙8 Gen2芯片，Pro版搭载高通骁龙8 Gen3芯片。其中骁龙8 Gen3是高通新一代移动平台，这颗芯片将于10月底登场，预计会由小米14系列全球首发。\n\n\n\n\n它基于台积电N4P工艺制程打造，CPU部分由1*3.19GHz X4+5*2.96GHz A720+2*2.27GHz A520组成，GPU是Adreno 750。对比高通骁龙8 Gen2，骁龙8 Gen3多了一颗性能核心，少了一颗能效核心，而且超大核升级为Cortex X4，是高通史上最强悍的手机芯片。搭载骁龙8 Gen3的Redmi K70系列将是新一代旗舰焊门员，这也是Redmi今年最后一款大作。按照卢伟冰激进的定价风格，K70系列成为爆款几乎没有什么悬念。\n\n\n\n\n【本文结束】如需转载请务必注明出处：快科技责任编辑：振亭","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"},"commentList":[],"isCommentEnd":true,"newsSizeData":{"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"likeStatus":false,"favoriteStatus":false},"APP":{"userAgent":"Mozilla/5.0 AppleWebKit/537.36 (KHTML, like Gecko; compatible; ClaudeBot/1.0; +claudebot@anthropic.com)","isDev":false,"isTTM":false,"tenantId":"TBCN","deviceId":"web-server-community-laohu8-v3","version":"4.36.2","shortVersion":"4.36.2","platform":"web","vendor":"web","appName":"laohu8","isIOS":false,"isAndroid":false,"isTiger":false,"isTHS":false,"isWeiXin":false,"isWeiXinMini":false,"isWeiBo":false,"isQQ":false,"isBaiduSwan":false,"isBaiduBox":false,"isDingTalk":false,"isToutiao":false,"isOnePlus":false,"isHuaWei":false,"isXiaomi":false,"isXiaomiWebView":false,"isOppo":false,"isVivo":false,"isSamsung":false,"isMobile":false},"href":"/m/news/2370456052","isCrawlerRequest":true}