富士康董事长刘扬伟谈半导体未来三年布局：自有车用关键IC量产

格隆汇APP2022-05-31

格隆汇5月31日丨据台湾电子时报，富士康31日召开股东会，谈到半导体未来三年布局，董事长刘扬伟立下三大目标，包含自有车用关键IC量产、自有车用小IC涵盖90%规格、车用小IC足量不缺料供应等，要成为首家能提供电动车(EV)与资通讯(ICT)客户不缺料半导体方案的系统厂。

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