施耐德电气与AMD联合发布首款Helios平台参考设计，加速AI工厂部署
美股速递
03:02
施耐德电气与AMD携手推出了首个Helios平台参考设计。此举旨在显著加快人工智能工厂的部署进程。这一合作无疑为AI基础设施建设注入了新动能。
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