康特科技获超1.05亿美元多系统订单，客户为一线OSAT与领先HBM制造商

投资观察06-02

康特科技宣布，已从一家一线外包半导体封装与测试服务商及一家领先的高带宽内存制造商处，获得了总额超过1.05亿美元的多系统订单。公司预计，所有订单均将在2027年完成交付。

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