惠科股份拟斥资40亿元设立子公司，布局先进芯片封装测试项目

美股速递07-17

惠科股份宣布，计划投资40亿元人民币，设立一家专注于先进芯片封装与测试业务的全新子公司。这一重大投资举措旨在深化公司在半导体产业链关键环节的布局，提升其在高技术附加值领域的竞争力。

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