天域半导体(02658)_个股概要_股票价格_最新资讯_行情走势_历史数据 - 老虎社区

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02658 天域半导体

未开盘 01-29 16:08:24

50.250

-1.750

-3.37%

最高52.900	最低49.780	成交量15.64万
今开52.000	昨收52.000	日振幅6.00%
总市值197.62亿	流通市值29.64亿	总股本3.93亿
成交额795.25万	换手率0.27%	流通股本5,899万
市净率--	ROE--	每股收益0.00
52周最高--	52周最低--	市盈率--
股息--	股息收益率--	ROA--

数据加载中...

北京优虎网络科技有限公司

免责声明:香港交易所资讯服务有限公司、其控股公司及／或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度，但不能保证其绝对准确和可靠，且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任（不管是否侵权法下的责任或合约责任又或其它责任）

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天域半导体股价跌4.57%，报收48.48元，成交金额823.3万元，换手率0.28%，振幅7.68%，量比0.43。天域半导体今日主力资金净流出31.4万元，连续4日净流出，上一交易日主力净流出496.0万元。该股近5个交易日下跌15.01%，主力资金累计净流出804.6万元；近20日主力资金累计净流入717.0万元，其中净流入天数为10日。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260126162047a6ad6092&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Corp发布了一项热管理技术——可键合金刚石。与传统依赖热界面材料的方案相比，可键合金刚石技术可将界面热阻降低高达99%，显著提升冷却性能，并适配尺寸达100mm×100mm的芯片。产品主要为导热材料及EMI材料，达产后预计年产能为450吨。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260124105555a45047e5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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共同推进先进键合材料工艺开发","url":"https://stock-news.laohu8.com/highlight/detail?id=2604901789","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604901789?lang=zh_cn&edition=full","pubTime":"2026-01-19 11:30","pubTimestamp":1768793401,"startTime":"0","endTime":"0","summary":"智通财经APP获悉，天域半导体再涨超6%，截至发稿，涨6.43%，报54.65港元，成交额1388.52万港元。通过结合公司在SiC外延片领域的行业实力与青禾芯片在键合集成技术及设备方面的专业知识，合作旨在促进先进键合材料解决方案的开发并优化生产工艺。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1394372.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"港股异动 | 天域半导体(02658)再涨超6% 与青禾芯片达成战略合作 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公布，于2026年1月16日，公司及青禾芯片半导体科技(集团)有限责任公司订立战略合作协议，据此，协议订约方同意建立战略合作，凭借公司在碳化硅材料领域的优势及青禾芯片在键合设备定制与优化方面的能力，共同开展键合材料的工艺开发及技术迭代。董事会认为，订约方将利用彼等各自的竞争优势，建立互利互惠的合作伙伴关系。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1394075.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02658","BK1169","BK4588","BK4535","BK4585"],"gpt_icon":0},{"id":"1133811508","title":"天域半导体携手合作方 共同开发键合材料及其他相关产品","url":"https://stock-news.laohu8.com/highlight/detail?id=1133811508","media":"美股速递","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1133811508?lang=zh_cn&edition=full","pubTime":"2026-01-16 21:17","pubTimestamp":1768569442,"startTime":"0","endTime":"0","summary":"广东天域半导体股份有限公司近日宣布，将与合作伙伴共同推进键合材料等产品的研发工作。此次合作旨在拓展公司在半导体材料领域的技术布局，提升产品竞争力。\n键合材料作为半导体制造过程中的关键材料，其性能直接影响芯片的可靠性和良率。天域半导体此次联合开发计划，将聚焦高性能键合材料的创新突破，助力国产半导体材料产业链的完善与发展。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1169","02658"],"gpt_icon":0},{"id":"2603243647","title":"天域半导体01月14日主力净流出3.5万元 散户资金买入","url":"https://stock-news.laohu8.com/highlight/detail?id=2603243647","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2603243647?lang=zh_cn&edition=full","pubTime":"2026-01-14 16:16","pubTimestamp":1768378569,"startTime":"0","endTime":"0","summary":"01月14日, 天域半导体股价跌2.46%，报收48.42元，成交金额1455.3万元，换手率0.49%，振幅7.31%，量比1.65。天域半导体今日主力资金净流出3.5万元，上一交易日主力净流入72.3万元。该股近5个交易日上涨3.02%，主力资金累计净流入538.4万元，其中1个交易日为股价下跌时净流入；近20日主力资金累计净流入849.3万元，其中净流入天数为10日。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260114162649a7195631&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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