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02658 天域半导体
未开盘 02-09 16:08:29
51.500
+2.600
+5.32%
最高
54.500
最低
49.700
成交量
43.10万
今开
50.000
昨收
48.900
日振幅
9.82%
总市值
202.53亿
流通市值
30.38亿
总股本
3.93亿
成交额
2,263万
换手率
0.73%
流通股本
5,899万
市净率
--
ROE
--
每股收益
0.00
52周最高
--
52周最低
--
市盈率
--
股息
--
股息收益率
--
ROA
--
分时
五日
日K
周K
月K
数据加载中...
北京优虎网络科技有限公司
免责声明:香港交易所资讯服务有限公司、其控股公司及/或该等控股公司的任何附属公司均竭力确保所提供信息的准确和可靠度,但不能保证其绝对准确和可靠,且亦不会承担因任何不准确或遗漏而引起的任何损失或损害的责任(不管是否侵权法下的责任或合约责任又或其它责任)
资讯
新帖
简况
港股异动 | 天域半导体(02658)早盘涨超11% 公司与韩国EYEQ Lab围绕SiC外延片达成战略合作
智通财经 · 02-09 10:29
港股异动 | 天域半导体(02658)早盘涨超11% 公司与韩国EYEQ Lab围绕SiC外延片达成战略合作
全球SiC核心客户的“中国选择”:为什么是天域半导体(02658)?
智通财经 · 02-07 19:15
全球SiC核心客户的“中国选择”:为什么是天域半导体(02658)?
天域半导体(02658)逆势收涨4.09%!联手韩国“芯片大脑”EYEQ Lab,聚焦SiC外延片供应
智通财经 · 02-06
天域半导体(02658)逆势收涨4.09%!联手韩国“芯片大脑”EYEQ Lab,聚焦SiC外延片供应
天域半导体与EYEQ Lab签三年战略合作协议 聚焦碳化硅外延片供应与应用
财中社 · 02-06
天域半导体与EYEQ Lab签三年战略合作协议 聚焦碳化硅外延片供应与应用
广东天域半导体:碳化硅外延片供应与应用达成合作
美股速递 · 02-06
广东天域半导体:碳化硅外延片供应与应用达成合作
天域半导体02月05日主力净流入78.5万元 散户资金抛售
市场透视 · 02-05
天域半导体02月05日主力净流入78.5万元 散户资金抛售
广东天域半导体(2658)2026年1月股份变动月报表:股本保持稳定
公告速递 · 02-03
广东天域半导体(2658)2026年1月股份变动月报表:股本保持稳定
天域半导体02月02日主力净流出180.5万元 散户资金买入
市场透视 · 02-02
天域半导体02月02日主力净流出180.5万元 散户资金买入
天域半导体01月29日主力净流出34.7万元 散户资金买入
市场透视 · 01-29
天域半导体01月29日主力净流出34.7万元 散户资金买入
天域半导体01月26日遭主力抛售31.4万元
市场透视 · 01-26
天域半导体01月26日遭主力抛售31.4万元
导热材料周报:多点布局提速,高端产品与技术迭代并行
中国粉体网 · 01-24
导热材料周报:多点布局提速,高端产品与技术迭代并行
智通港股52周新高、新低统计|1月19日
智通财经网 · 01-19
智通港股52周新高、新低统计|1月19日
天域半导体(02658.HK)再涨超6%
每日经济新闻 · 01-19
天域半导体(02658.HK)再涨超6%
港股异动 | 天域半导体(02658)再涨超6% 与青禾芯片达成战略合作 共同推进先进键合材料工艺开发
智通财经 · 01-19
港股异动 | 天域半导体(02658)再涨超6% 与青禾芯片达成战略合作 共同推进先进键合材料工艺开发
天域半导体(02658)与青禾芯片订立战略合作协议 共同开展键合材料的工艺开发及技术迭代
智通财经 · 01-16
天域半导体(02658)与青禾芯片订立战略合作协议 共同开展键合材料的工艺开发及技术迭代
天域半导体携手合作方 共同开发键合材料及其他相关产品
美股速递 · 01-16
天域半导体携手合作方 共同开发键合材料及其他相关产品
天域半导体01月14日主力净流出3.5万元 散户资金买入
市场透视 · 01-14
天域半导体01月14日主力净流出3.5万元 散户资金买入
天域半导体01月08日主力净流入125.8万元 散户资金抛售
市场透视 · 01-08
天域半导体01月08日主力净流入125.8万元 散户资金抛售
天域半导体01月05日获主力加仓68.4万元
市场透视 · 01-05
天域半导体01月05日获主力加仓68.4万元
天域半导体(02658)稳定价格期结束、无稳定价格行动及超额配股权失效
智通财经网 · 01-01
天域半导体(02658)稳定价格期结束、无稳定价格行动及超额配股权失效
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公司概况
公司名称:
天域半导体
所属市场:
SEHK
上市日期:
--
主营业务:
我们是中国碳化硅外延片制造商中最大的碳化硅外延片制造商,以收入及销量计的市场份额分别为30.6%及32.5%。外延片是生产功率半导体器件的关键原材料。与硅等传统半导体材料比较,碳化硅(作为第三代半导体材料之一)具有显著的性能优势,更适用于高压、高温及高频率环境。透过切割、研磨及抛光碳化硅衬底(我们产品的主要原材料),即可获得用于生长外延层、同时具备特定晶面以及适当电学、光学和机械性能的单个外延片。通过外延工艺,可在外延片上生长出特定的单晶薄膜。
发行价格:
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Lab围绕SiC外延片达成战略合作","url":"https://stock-news.laohu8.com/highlight/detail?id=2610502825","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2610502825?lang=zh_cn&edition=full","pubTime":"2026-02-09 10:29","pubTimestamp":1770604149,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,天域半导体早盘涨超11%,截至发稿,涨10.63%,报54.1港元,成交额1356.92万港元。消息面上,天域半导体近日宣布,与韩国知名半导体制造商EYEQ Lab签订战略合作协议。根据公告,天域半导体将向EYEQ Lab提供规格覆盖6至8英寸、650V至20,000V的高质量SiC外延片,适用于单极型及双极型功率电子器件。EYEQ Lab则在同等条件下优先采购天域半导体提供的碳化硅外延片。董事会认为,与EYEQ Lab的战略合作符合公司及其股东的整体利益,有利于推动集团长远发展。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1403000.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02658","BK4588","BK1169","BK4585","VXUS","VT"],"gpt_icon":0},{"id":"2609542718","title":"全球SiC核心客户的“中国选择”:为什么是天域半导体(02658)?","url":"https://stock-news.laohu8.com/highlight/detail?id=2609542718","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609542718?lang=zh_cn&edition=full","pubTime":"2026-02-07 19:15","pubTimestamp":1770462954,"startTime":"0","endTime":"0","summary":"2月6日晚间的一纸公告,揭示出中国SiC外延片领域龙头天域半导体迎来了蓄势已久的“放量时刻”。根据天域半导体方面披露的相关公告,公司与韩国EYEQ Lab Inc.签订碳化硅外延片领域的战略合作协议。EYEQ Lab则在同等条件下优先采购天域半导体提供的碳化硅外延片,为期三年。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1402853.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02658","BK1169"],"gpt_icon":0},{"id":"2609561829","title":"天域半导体(02658)逆势收涨4.09%!联手韩国“芯片大脑”EYEQ Lab,聚焦SiC外延片供应","url":"https://stock-news.laohu8.com/highlight/detail?id=2609561829","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609561829?lang=zh_cn&edition=full","pubTime":"2026-02-06 17:57","pubTimestamp":1770371848,"startTime":"0","endTime":"0","summary":"消息面上,公司于盘后发布自愿性公告,宣布与韩国知名半导体制造商EYEQ Lab签订战略合作协议。根据公告,天域半导体将向EYEQ Lab提供规格覆盖6至8英寸、650V至20,000V的高质量SiC外延片,适用于单极型及双极型功率电子器件。EYEQ Lab则在同等条件下优先采购天域半导体提供的碳化硅外延片。董事会认为,与EYEQ Lab的战略合作符合公司及其股东的整体利益,有利于推动集团长远发展。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1402608.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK4585","BK4588","BK1169","BK4535","02658"],"gpt_icon":0},{"id":"2609569254","title":"天域半导体与EYEQ Lab签三年战略合作协议 聚焦碳化硅外延片供应与应用","url":"https://stock-news.laohu8.com/highlight/detail?id=2609569254","media":"财中社","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609569254?lang=zh_cn&edition=full","pubTime":"2026-02-06 17:47","pubTimestamp":1770371241,"startTime":"0","endTime":"0","summary":"天域半导体(02658)发布公告,2026年2月6日,公司与EYEQLabInc签订了战略合作协议。根据协议,双方将建立战略合作伙伴关系,专注于碳化硅(SiC)外延片的供应与应用。合作内容包括公司向EYEQLab提供覆盖6至8英寸、650V至20,000V的高质量SiC外延片,并在同等条件下,EYEQLab将优先采购公司的SiC外延片。协议自签署日起生效,有效期为三年。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202602063644201584.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK1169","02658"],"gpt_icon":0},{"id":"1195431386","title":"广东天域半导体:碳化硅外延片供应与应用达成合作","url":"https://stock-news.laohu8.com/highlight/detail?id=1195431386","media":"美股速递","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1195431386?lang=zh_cn&edition=full","pubTime":"2026-02-06 17:34","pubTimestamp":1770370483,"startTime":"0","endTime":"0","summary":"广东天域半导体近日就碳化硅外延片的供应及其应用领域与相关方签署合作协议。此次合作旨在推动碳化硅材料在半导体产业的高效应用,强化产业链上下游协同。碳化硅外延片作为第三代半导体关键材料,在新能源、电力电子等领域具有广阔前景。该合作将助力天域半导体提升技术竞争力,拓展市场空间。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["BK1169","02658"],"gpt_icon":0},{"id":"2609556864","title":"天域半导体02月05日主力净流入78.5万元 散户资金抛售","url":"https://stock-news.laohu8.com/highlight/detail?id=2609556864","media":"市场透视","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2609556864?lang=zh_cn&edition=full","pubTime":"2026-02-05 16:16","pubTimestamp":1770279360,"startTime":"0","endTime":"0","summary":"02月05日, 天域半导体股价涨2.49%,报收46.98元,成交金额485.9万元,换手率0.18%,振幅4.19%,量比0.79。天域半导体今日主力资金净流入78.5万元,上一交易日主力净流出0万元。该股近5个交易日下跌6.51%,主力资金累计净流出157.9万元,其中1个交易日为股价上涨时净流出;近20日主力资金累计净流入418.9万元,其中净流入天数为10日。该股主力净额占比0.03%,港股市场排名192/2715。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260205162248a6d6476b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260205162248a6d6476b&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK1169","02658"],"gpt_icon":0},{"id":"1108283568","title":"广东天域半导体(2658)2026年1月股份变动月报表:股本保持稳定","url":"https://stock-news.laohu8.com/highlight/detail?id=1108283568","media":"公告速递","labels":["SGX"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1108283568?lang=zh_cn&edition=full","pubTime":"2026-02-03 17:52","pubTimestamp":1770112366,"startTime":"0","endTime":"0","summary":"2026年2月3日,广东天域半导体股份有限公司(股票代码:02658)披露2026年1月股份变动月报表,披露期自2026年1月1日至1月31日。\n根据公告,截至1月31日,该公司已发行股本合计为393,268,511股(面值每股人民币1元),包括在香港联交所上市的H股58,990,426股以及未上市股份334,278,085股。月内未发生新增股份发行、购回或注销,也无任何库存股变动。\n公司确认,已遵守香港联交所关于公众持股量的要求,H股数量占已发行股份总数的最低公众持股比例(15%)保持不变。公告由联席公司秘书李焯星签署。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02658"],"gpt_icon":0},{"id":"2608385179","title":"天域半导体02月02日主力净流出180.5万元 散户资金买入","url":"https://stock-news.laohu8.com/highlight/detail?id=2608385179","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2608385179?lang=zh_cn&edition=full","pubTime":"2026-02-02 16:15","pubTimestamp":1770020140,"startTime":"0","endTime":"0","summary":"02月02日, 天域半导体股价跌4.83%,报收47.68元,成交金额807.5万元,换手率0.28%,振幅8.84%,量比0.90。天域半导体今日主力资金净流出180.5万元,上一交易日主力净流入32.2万元。该股近5个交易日下跌1.82%,主力资金累计净流出1.8万元;近20日主力资金累计净流入554.2万元,其中净流入天数为10日。该股主力净额占比0.06%,港股市场排名2562/2710。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260202161933a4727ba4&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260202161933a4727ba4&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["02658","BK1169"],"gpt_icon":0},{"id":"2607850270","title":"天域半导体01月29日主力净流出34.7万元 散户资金买入","url":"https://stock-news.laohu8.com/highlight/detail?id=2607850270","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2607850270?lang=zh_cn&edition=full","pubTime":"2026-01-29 16:15","pubTimestamp":1769674531,"startTime":"0","endTime":"0","summary":"01月29日, 天域半导体股价跌3.37%,报收50.25元,成交金额795.3万元,换手率0.27%,振幅6.00%,量比0.54。天域半导体今日主力资金净流出34.7万元,上一交易日主力净流入86.9万元。该股近5个交易日下跌4.85%,主力资金累计净流出380.8万元;近20日主力资金累计净流入877.1万元,其中净流入天数为11日。该股主力净额占比0.01%,港股市场排名2412/2708。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260129161809a6bacb09&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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天域半导体股价跌4.57%,报收48.48元,成交金额823.3万元,换手率0.28%,振幅7.68%,量比0.43。天域半导体今日主力资金净流出31.4万元,连续4日净流出,上一交易日主力净流出496.0万元。该股近5个交易日下跌15.01%,主力资金累计净流出804.6万元;近20日主力资金累计净流入717.0万元,其中净流入天数为10日。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260126162047a6ad6092&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Corp发布了一项热管理技术——可键合金刚石。与传统依赖热界面材料的方案相比,可键合金刚石技术可将界面热阻降低高达99%,显著提升冷却性能,并适配尺寸达100mm×100mm的芯片。产品主要为导热材料及EMI材料,达产后预计年产能为450吨。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260124105555a45047e5&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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16:40","pubTimestamp":1768812001,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,截止1月19日收盘,有108只股票创52周新高,其中建成控股、新世界发展、百德国际创高率位于前3位,分别为31.25%、21.15%、18.00%。","market":"sg","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1394502.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"highlight_zhitongcaijin","symbols":["01262","00162","00214","02658","00966","01953","00014","00993","00016","01300","02655","00219","02259","02516","03858","01133","00590","00341","01196","00017","00876","00052","01333","01746","02276","00034","02350","02685","00338","01138","00386","00508","02650","00631","01118","02381","00089","00001","02570","00670","02210","01283","01481","01004","01176","01500","00224","02331"],"gpt_icon":1},{"id":"2604904278","title":"天域半导体(02658.HK)再涨超6%","url":"https://stock-news.laohu8.com/highlight/detail?id=2604904278","media":"每日经济新闻","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604904278?lang=zh_cn&edition=full","pubTime":"2026-01-19 12:04","pubTimestamp":1768795486,"startTime":"0","endTime":"0","summary":"每经AI快讯,天域半导体(02658.HK)再涨超6%,截至发稿涨6.43%,报54.65港元,成交额1388.52万港元。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202601193623098990.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202601193623098990.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["02658","BK1169"],"gpt_icon":0},{"id":"2604901789","title":"港股异动 | 天域半导体(02658)再涨超6% 与青禾芯片达成战略合作 共同推进先进键合材料工艺开发","url":"https://stock-news.laohu8.com/highlight/detail?id=2604901789","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2604901789?lang=zh_cn&edition=full","pubTime":"2026-01-19 11:30","pubTimestamp":1768793401,"startTime":"0","endTime":"0","summary":"智通财经APP获悉,天域半导体再涨超6%,截至发稿,涨6.43%,报54.65港元,成交额1388.52万港元。通过结合公司在SiC外延片领域的行业实力与青禾芯片在键合集成技术及设备方面的专业知识,合作旨在促进先进键合材料解决方案的开发并优化生产工艺。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1394372.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":"港股异动 | 天域半导体(02658)再涨超6% 与青禾芯片达成战略合作 共同推进先进键合材料工艺开发","news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK1169","BK4535","02658","BK4585","BK4588"],"gpt_icon":0},{"id":"2603996167","title":"天域半导体(02658)与青禾芯片订立战略合作协议 共同开展键合材料的工艺开发及技术迭代","url":"https://stock-news.laohu8.com/highlight/detail?id=2603996167","media":"智通财经","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2603996167?lang=zh_cn&edition=full","pubTime":"2026-01-16 21:17","pubTimestamp":1768569458,"startTime":"0","endTime":"0","summary":"智通财经APP讯,天域半导体 公布,于2026年1月16日,公司及青禾芯片半导体科技(集团)有限责任公司订立战略合作协议,据此,协议订约方同意建立战略合作,凭借公司在碳化硅材料领域的优势及青禾芯片在键合设备定制与优化方面的能力,共同开展键合材料的工艺开发及技术迭代。董事会认为,订约方将利用彼等各自的竞争优势,建立互利互惠的合作伙伴关系。","market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1394075.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["BK4535","BK4585","02658","BK1169","BK4588"],"gpt_icon":0},{"id":"1133811508","title":"天域半导体携手合作方 共同开发键合材料及其他相关产品","url":"https://stock-news.laohu8.com/highlight/detail?id=1133811508","media":"美股速递","labels":["corporation"],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/1133811508?lang=zh_cn&edition=full","pubTime":"2026-01-16 21:17","pubTimestamp":1768569442,"startTime":"0","endTime":"0","summary":"广东天域半导体股份有限公司近日宣布,将与合作伙伴共同推进键合材料等产品的研发工作。此次合作旨在拓展公司在半导体材料领域的技术布局,提升产品竞争力。\n键合材料作为半导体制造过程中的关键材料,其性能直接影响芯片的可靠性和良率。天域半导体此次联合开发计划,将聚焦高性能键合材料的创新突破,助力国产半导体材料产业链的完善与发展。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02658","BK1169"],"gpt_icon":0},{"id":"2603243647","title":"天域半导体01月14日主力净流出3.5万元 散户资金买入","url":"https://stock-news.laohu8.com/highlight/detail?id=2603243647","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://www.laohu8.com/m/news/2603243647?lang=zh_cn&edition=full","pubTime":"2026-01-14 16:16","pubTimestamp":1768378569,"startTime":"0","endTime":"0","summary":"01月14日, 天域半导体股价跌2.46%,报收48.42元,成交金额1455.3万元,换手率0.49%,振幅7.31%,量比1.65。天域半导体今日主力资金净流出3.5万元,上一交易日主力净流入72.3万元。该股近5个交易日上涨3.02%,主力资金累计净流入538.4万元,其中1个交易日为股价下跌时净流入;近20日主力资金累计净流入849.3万元,其中净流入天数为10日。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260114162649a7195631&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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天域半导体股价涨1.45%,报收47.68元,成交金额625.0万元,换手率0.22%,振幅3.49%,量比0.73。天域半导体今日主力资金净流入125.8万元,上一交易日主力净流出0万元。该股近5个交易日下跌1.17%,主力资金累计净流入300.3万元;近20日主力资金累计净流入2470.5万元,其中净流入天数为11日。该股主力净额占比0.04%,港股市场排名161/2713。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260108161801a7021e93&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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